Servo hydraulic station for semiconductor industry

In the field of semiconductor packaging equipment, through technical cooperation with the Chinese Academy of Sciences, the gas-liquid combination system of Austrian EVG company has been safely replaced, and technical breakthroughs and breakthroughs have been achieved in the field of lithographic nanostamping technology (N12). Providing uniform pressure for semiconductor chip manufacturing and controlling the maximum displacement accuracy at 0.75μm ensures that the chip can play better performance and better energy consumption, while reducing the noise of the hydraulic power system to A minimum of 55dB(A).

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